• Development and manufacturing of industrial High Frequency (HF) embossing and cutting machines - 50T 20KW. • Involved in the design of Industrial machines incorporating Automation, Electric, Electronic, Mechanic, Hydraulic, Pneumatic and Ultrasonic. • Technical support. • Cost reduction, reliability and EMI shielding improvement of HF machines. • Design to meet international standards. • Co-ordination of Product-Engineering (PE) activities.

Tasks: • All activities related to electronic product engineering: model design, electronic design, material selection, tester design and manufacturing, PCB design, parts and material acquisition, module prototyping and production. • Co-ordination of all Engineering activities and outsourcing projects - with local and overseas subcontractors: electronic manufacturing services, ASIC design houses, PCB designers, PCB manufactures, Full turn-key Electronic Manufacturing Service (EMS) providers, plastic mold designers and manufacturers, mechanical parts designers and manufacturers. • Generation of all associated documentation and production files. • All activities related to ASIC design; survey for ASIC design house, writing analog and digital ASIC specifications, conducting follow-up throughout the various ASIC design and manufacturing phases (feasibility study, analog design, design simulations, Layout, Post layout simulations, IC packaging and EO MCM design). ASIC evaluation and testing, Reliability tests, Track and enhance yield and quality. QA and QC. • R&D team-member in design and manufacture of IR wireless systems for consumer audio. • Sales and marketing activities: demonstration and presentation in IFA and CES shows. Pre-sale and technical support communication with distributors, representatives and customers (FE, Europe, USA and Japan). • Product cost analysis: cost-reduction by identifying cost effective materials, components and vendors. • Established company database for material acquisition and production. • Design in accordance with international safety standards (UL and CE) and EMI/RFI (FCC and CE) including approval and certification.

Tasks: • Planning and conducting environmental and EMI/RFI testing per MIL/FAA standards for avionic systems. Writing QA procedures per FAA standards. Writing rework and installation procedures for the installation of an avionic system. • Design of high voltage power supply of fluorescent light for back-light of flat-panel display. Design of IR wireless communication for portable computers.

Tasks: • Service of multi-discipline system incorporating computers - software and hardware; lasers - interferometers and power; pneumatic; electro-optics; micro-electronics; sub-micron mechanics. • Training of and working with Japanese team and customers.

Microelectronics, RF, Electro optics, Communication,